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Hastelloy C 276 Electrode For Flowmeter
Hastelloy electrodes for magnetic flow meter. The electrodes widely used for electromagnetic flow meter producing, we can customized according your requirements. 316L electrode , Titanium electrode ,Tantalum electrode ,Hastelloy-C electrode.
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Hastelloy C22 Pipe fittings
Hastelloy C 22 Pipe fittings ( Short Radius Elbows , Long Radius Elbows , Concentric Reducers , Eccentric Reducers , Stub Ends , End Caps , Equal Tees , Weldolets , Pipe Nipples .) ASME/ANSI B16.9, ASME B16.28, MSS-SP-43, MSS SP-79 , Type Seamless / Welded / Fabricated . Hastelloy C-22 / UNS N06022 / DIN W. Nr. 2.4602
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Hastelloy C 276 Pipe fittings
Hastelloy C 276 Pipe fittings ( Short Radius Elbows , Long Radius Elbows , Concentric Reducers , Eccentric Reducers , Stub Ends , End Caps , Equal Tees , Weldolets , Pipe Nipples .) ASME/ANSI B16.9, ASME B16.28, MSS-SP-43, MSS SP-79 , Type Seamless / Welded / Fabricated Hastelloy C276 Pipe Fittings UNS (N10276), DIN (2.4819).
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Inconel 625 Rod
Inconel Round Bar , ASTM B446 Inconel, 625 Bright Round Rod , Inconel 625 Hex Rods ,Inconel 625 flat bar with standard ASTM B446 / ASME SB446 and Nickel Alloy 625/ Inconel 625 (AMS 5666)
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Inconel 601 Welding Wire
Inconel 601 Welding Wire - UNS N06601 - DIN W. Nr.2.4851 . ERNiCrFe-11 (Alloy 601) . ASME II, Part C, SFA-5.14, ERNiCrFe-11 (UNS N06601) , ASME IX, F-No.43 , BS290] NA 49 , DIN 1736 SG-NiCr23Al (2.4626) , (EN) ISO 18274 - SN16601 (NiCr23Fel5Al) , ASME III (NCA3800, NB2400), AMS and other specifications
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Inconel 600 Welding Wire
Inconel 600 Wire ASTM B166 , Inconel 600 welding wire Alloy 600. UNS N06600 / W.Nr. 2.4816 .Nickel Alloy (AWS A5.11) ENiCrFe-3 Welding Electrode, Nickel Alloy ENiCrFe-3 Welding Electrode, ENiCrFe-3 inconel 600
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Invar 32 Wire
Invar 32 Wire Super-Invar 32-5 rod UNS-K-93500, Consisting of 32% Nickel, 5% Cobalt, and the balance Iron, this alloy exhibits minimum thermal expansion (one half of Invar 36) at room temperature. It is often used in structural components, supports and substrates requiring precision measurements. ASTM F1684.
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Invar 32 Sheet
Invar 32 Sheet, plate , Invar Alloy Foil , Super Invar 32-5 Alloy DESCRIPTION. A low expansion alloy consisting of 32% Nickel, 5% Cobalt, balance Iron. This alloy exhibits minimum thermal expansion (one half of Invar 36) Invar-36, Invar-42, Pernifer 36, Invar Steel, Super Invar 32-5, Carpenter 36, 4J32, 4J36
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Invar 36 Plate
Alloy 36 Sheet (Invar) / K93603 / ASTM F1684 Widely known under several trades names such as Invar and Nilo 36**, this grade is a 36% nickel-iron alloy. AMS l-23011 CL7MIL l-23011 CL7UNS K93602/03 4J36 (China), Fe-Ni36 (France), 1.3912, Ni36 (Germany), X1NiCrMoCu, N 25-20-7 (UK) Invar 36, UNSK93600 thermostat alloy, UNSK93601 pressure vessel sheet (USA)
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Alloy 46 Wire
Alloy 46 wire : Consisting of 46% nickel and iron balance, 46 Alloy is a controlled expansion alloy used mostly in electronic applications, especially for glass and ceramic seals. Alloy 46 is also known as Pernifer 462, NILO 464, and Glass-Seal 461 , ,Fe46Ni
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Alloy 46 Sheet
Alloy 46: Consisting of 46% nickel and iron balance, 46 Alloy is a controlled expansion alloy used mostly in electronic applications, especially for glass and ceramic seals. Alloy 46 is also known as Pernifer 462, NILO 464, and Glass-Seal 461
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MP35N Thread Bolt Fastener
MP35N Thread Rod , MP35N bolts , MP35N fasteners , UNS R30035 bolts , MP35N Thread Bar, MP35N Specifications: AMS 5844, AMS 5845, AMS7468, ASTM F562, NACE MR0175. MP35N alloys are used in fasteners, springs, non-magnetic assemblies and instrumentation components in medical, marine, oil and gas well, chemical and food processing environments.
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Photocatalytic Films Monb Sputtering Target With Cooper Backing Plate For Contact Layers

Facingtarget sputtering deposition of ZnO films with Pt

In this paper, various zinc oxide (ZnO) films are deposited by a versatile and effective dc-reactive facing-target sputtering method. The ratios of Ar to O 2 in the mixture gas are varied from 8:2 to 6:4 at a fixed sputtering pressure of Pa. X-ray diffraction, spectrophotometer and scanning electron microscope are used to study the crystal structure, optical property and surface morphology

The Photocatalytic Activity and Compact Layer Characteristics

ResearchArticle The Photocatalytic Activity and Compact Layer Characteristics of TiO 2 Films Prepared Using Radio Frequency Magnetron Sputtering ,1 ,2 ,2 ,1

Photocatalytic titanium dioxide thin films prepared by

An innovative reactive pulse magnetron sputtering (PMS) system allowing to change the pulse mode (unipolar, bipolar or pulse packet) has been used to deposit TiO 2 films at dynamic deposition rates of 850 nm m/min. Photo-induced hydrophilicity and photocatalytic degradation by UV-A illumination were investigated by measuring the decrease of the water angle and the decomposition of

Decomposition ability and bioactivity of photocatalytic TiO

For same photocatalytic layers the photocatalytic activity differs when using different measuring methods, like photoinduced hydrophilicity, photocatalytic decomposition of organic matter or biocidal effect on algae and bacteria. Therefore, optimisation of photocatalytic properties must be conducted according to application.

High rate deposition of photocatalytic TiO2 films by dc

Photocatalytic TiO2 films were deposited on glass substrates by dc magnetron sputtering using a slightly reduced TiO2?x target (2?x=; conductivity, S cm?1; density, g/cm3).

Reactive sputtering deposition of photocatalytic TiO2 thin

Titania polycrystalline thin films with high photocatalytic activity were produced by dc reactive magnetron sputtering. X-ray diffraction experiments revealed that the as-deposited films are amorphous and thus unable to deliver an optimum photocatalytic efficiency.

Photocatalytic TiO2 films deposited by rf magnetron

Photocatalytic TiO2 films deposited by rf magnetron sputtering at different oxygen partial pressure Article in Current Applied Physics 10(6) · November 2010 with 14 Reads How we measure reads

Photocatalytic properties of Au/TiO2 thin films prepared by

The Au/TiO 2 thin films had the best photocatalytic activity when they were UV treated for 1 h, so the UV treatment time was fixed at 1 h. The photocatalytic properties of the prepared thin films were tested by measuring the decomposition of methylene blue in the presence of the thin film under UV irradiation.

High rate deposition of photocatalytic TiO2 films by DC

High rate deposition of photocatalytic TiO2 films by DC magnetron sputtering using a TiO2-x target High rate deposition of photocatalytic TiO. 2. sputter mode where the target surface was

Methods of rejuvenating sputtering targets . Starck Inc.

The backing plate and therefore also the sputter target can be in the form of a flat, rod, cylinder, block or any other desired shape. Additional structural components liquid cooling coils and/or a larger coolant reservoir and/or complex flanges or other mechanical or electrical structures can also be attached.

Is it necessary to use a metallic(copper) back plate for RF

Is it necessary to use a metallic(copper) back plate for RF sputtering target for non Thin Film Preparation. Share A special graphite paper under the target improves the thermal . A silicon dioxide target is in use without copper back plate. Innovative PVD layers and the latest PVD coating technology [ Innovative

Backing Plates for sputtering targets and thin film deposition

Materions backing plates used in the sputtering process create a quality thin film electrical between a sputtering target and backing plate; Permit good supplies Copper, Copper Alloys, Aluminum and Molybdenum backing plates.

Bonding sputtering targets to backing plates Plasmaterials

Provides all metal bonding to affix sputtering targets to backing plates for systems Backing plates are typically produced from OFE copper, non-magnetic diffusion barrier and wetting layers to the target and backing plates. After the application of this thin film composite, a specially designed solder is Email Address.

Backing Plates Sputtering Target Backing Plates – Angstrom

Angstrom Sciences provides a variety of backing plates designed for our Backing plates used in the sputtering process are essential to creating a quality thin film deposition for your copper-chromium) for planar, circular and cylindrical sputtering targets, Airco/BOCCT HRC 517, OFHC Copper, $2,, Contact ASI.

Indium Target Bonding Service Kurt J. Lesker Company

Thin Film Systems. Industries. LED Optics UHV/Synchrotron Electronics The target is in intimate with the conductive solder layer which draws the heat The copper backing plate is in with the water cooled gun so the heat is Indium is the preferred method for bonding sputtering targets because it has

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