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Hastelloy C 276 Electrode For Flowmeter
Hastelloy electrodes for magnetic flow meter. The electrodes widely used for electromagnetic flow meter producing, we can customized according your requirements. 316L electrode , Titanium electrode ,Tantalum electrode ,Hastelloy-C electrode.
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Hastelloy C22 Pipe fittings
Hastelloy C 22 Pipe fittings ( Short Radius Elbows , Long Radius Elbows , Concentric Reducers , Eccentric Reducers , Stub Ends , End Caps , Equal Tees , Weldolets , Pipe Nipples .) ASME/ANSI B16.9, ASME B16.28, MSS-SP-43, MSS SP-79 , Type Seamless / Welded / Fabricated . Hastelloy C-22 / UNS N06022 / DIN W. Nr. 2.4602
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Hastelloy C 276 Pipe fittings
Hastelloy C 276 Pipe fittings ( Short Radius Elbows , Long Radius Elbows , Concentric Reducers , Eccentric Reducers , Stub Ends , End Caps , Equal Tees , Weldolets , Pipe Nipples .) ASME/ANSI B16.9, ASME B16.28, MSS-SP-43, MSS SP-79 , Type Seamless / Welded / Fabricated Hastelloy C276 Pipe Fittings UNS (N10276), DIN (2.4819).
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Inconel 625 Rod
Inconel Round Bar , ASTM B446 Inconel, 625 Bright Round Rod , Inconel 625 Hex Rods ,Inconel 625 flat bar with standard ASTM B446 / ASME SB446 and Nickel Alloy 625/ Inconel 625 (AMS 5666)
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Inconel 601 Welding Wire
Inconel 601 Welding Wire - UNS N06601 - DIN W. Nr.2.4851 . ERNiCrFe-11 (Alloy 601) . ASME II, Part C, SFA-5.14, ERNiCrFe-11 (UNS N06601) , ASME IX, F-No.43 , BS290] NA 49 , DIN 1736 SG-NiCr23Al (2.4626) , (EN) ISO 18274 - SN16601 (NiCr23Fel5Al) , ASME III (NCA3800, NB2400), AMS and other specifications
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Inconel 600 Welding Wire
Inconel 600 Wire ASTM B166 , Inconel 600 welding wire Alloy 600. UNS N06600 / W.Nr. 2.4816 .Nickel Alloy (AWS A5.11) ENiCrFe-3 Welding Electrode, Nickel Alloy ENiCrFe-3 Welding Electrode, ENiCrFe-3 inconel 600
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Invar 32 Wire
Invar 32 Wire Super-Invar 32-5 rod UNS-K-93500, Consisting of 32% Nickel, 5% Cobalt, and the balance Iron, this alloy exhibits minimum thermal expansion (one half of Invar 36) at room temperature. It is often used in structural components, supports and substrates requiring precision measurements. ASTM F1684.
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Invar 32 Sheet
Invar 32 Sheet, plate , Invar Alloy Foil , Super Invar 32-5 Alloy DESCRIPTION. A low expansion alloy consisting of 32% Nickel, 5% Cobalt, balance Iron. This alloy exhibits minimum thermal expansion (one half of Invar 36) Invar-36, Invar-42, Pernifer 36, Invar Steel, Super Invar 32-5, Carpenter 36, 4J32, 4J36
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Invar 36 Plate
Alloy 36 Sheet (Invar) / K93603 / ASTM F1684 Widely known under several trades names such as Invar and Nilo 36**, this grade is a 36% nickel-iron alloy. AMS l-23011 CL7MIL l-23011 CL7UNS K93602/03 4J36 (China), Fe-Ni36 (France), 1.3912, Ni36 (Germany), X1NiCrMoCu, N 25-20-7 (UK) Invar 36, UNSK93600 thermostat alloy, UNSK93601 pressure vessel sheet (USA)
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Alloy 46 Wire
Alloy 46 wire : Consisting of 46% nickel and iron balance, 46 Alloy is a controlled expansion alloy used mostly in electronic applications, especially for glass and ceramic seals. Alloy 46 is also known as Pernifer 462, NILO 464, and Glass-Seal 461 , ,Fe46Ni
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Alloy 46 Sheet
Alloy 46: Consisting of 46% nickel and iron balance, 46 Alloy is a controlled expansion alloy used mostly in electronic applications, especially for glass and ceramic seals. Alloy 46 is also known as Pernifer 462, NILO 464, and Glass-Seal 461
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MP35N Thread Bolt Fastener
MP35N Thread Rod , MP35N bolts , MP35N fasteners , UNS R30035 bolts , MP35N Thread Bar, MP35N Specifications: AMS 5844, AMS 5845, AMS7468, ASTM F562, NACE MR0175. MP35N alloys are used in fasteners, springs, non-magnetic assemblies and instrumentation components in medical, marine, oil and gas well, chemical and food processing environments.
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Mocu Rf Device Package Flange

Cu/MoCu/Cu (CPC) Heat Sink,Electronic Packaging Materials

Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc. If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can us free.

Ceramic RF, Microwave and Power Packages Torrey Hills

We currently have more than 40 types of ceramic RF, microwave, and power packages with a maximum pulsed output power of up to 500W. Features and Benefits. Wide application in microwave devices and modules; Mainly consisting of high thermal conductivity materials Al2O3, BeO ceramic, WCu, and MoCu. Excellent thermal and microwave performance.

Solder Reflow Attach Method for High Power RF Devices in Air

As mentioned earlier, RF power devices are manufactured in both AC and Over--Molded Plastic (OMP) packages. Figure 3 shows the schematic representing a typical cross--section of an AC package. LEADS DIE WINDOW FLANGE FRAME LID Figure 3. Air Cavity Package Construction for Power Devices In an AC package, the Si die is typically attached to a Au

Low Rth Device Packaging for High Power RF LDMOS Transistors

Low Rth Device Packaging for High Power RF LDMOS Transistors for Cellular and 3G Base Station Use cooler operating RF PA devices. and the role of package flange

High Power RF LDMOS Devices Using Low Thermal Resistivity

Infineon Technologies has been able to reduce thermal resistance by reducing the device thickness, increasing the thermal conductivity of the package, and optimizing the device layout and RF circuitry. Lowering Thermal Resistance. A set of devices has recently been introduced using new thermally enhanced packages and die of reduced thickness.

RF Power Transistor Packages Components for Wireless

Kyocera provides packages for RF power transistors, including silicon LDMOS-FET devices, GaAs FET/HEMT devices and wide-band-gap semiconductor FET/HEMT devices using GaN, SiC and other materials. Our low-electrical-resistance ceramic feedthroughs and low-thermal-resistance heat-sink materials are available for high-power devices.

AN

Mounting Methods for High Power RF Ceramic Packaged Devices AN- Rev. V1 11 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) / process(s) or information contained herein without notice.

Ceramic Packages with very low thermal resistance Materion

Materion has developed a wide range of ceramic packages to meet your demands for very low thermal resistance. Our products also provide very low RF loss for RF and microwave microelectronics packaging. We can incorporate flanges of advanced materials to achieve the high power density requirements of RF power transistors.

Packages

Packaging is an important element in RF power transistors, influencing both the cost-efficiency and performance of a given device. Since peak powers can vary widely, from as low as 5 W to more than 1 kW, a range of packages is needed to cover every application.

RF Amplifiers Analog Devices

Analog Devices RF amplifiers are designed using the company’s leading amplifier and RF IC expertise. The company’s extensive family of single-ended, input/output, fixed-gain amplifiers can be used from low frequencies up to microwave and include gain blocks, low noise amplifiers, intermediate

Hermetic Packages Electronics Zhuzhou Jiabang Refractory Metal , Ltd

mocu carrier / heat sink for hermetic packages electronics with high coefficient of thermal Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

Ceramic RF, Microwave and Power Packages Torrey Hills

We currently have more than 40 types of ceramic RF, microwave, and power packages with a maximum pulsed output power of up to 500W. Features and Benefits. Wide application in microwave devices and modules; Mainly consisting of high thermal conductivity materials Al2O3, BeO ceramic, WCu, and MoCu. Excellent thermal and microwave performance.

Cu/MoCu/Cu (CPC) Heat Sink,Electronic Packaging Materials,Zhuzhou Jia

Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc. If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can us free.

No Magnetism CPC Heat Sink Flange , CuMoCuCu Heat Sink For RF Power

Quality Heat Sink manufacturers exporter - buy No Magnetism CPC Heat Sink Flange , CuMoCuCu Heat Sink For RF Power Device Package from China manufacturer.

Packages

The wide range of packages offered by Ampleon enables you to select the right device precisely optimized for your application and allows to find the best compromise between cost and performance.

High Power RF LDMOS Devices Using Low Thermal Resistivity Packages

Table 1 lists the results from standard Cu-W and thermally enhanced packages, under continuous wave (CW) and wideband code division multiple access (WCDMA) conditions, at both 70° and 95°C flange temperatures. It can be seen that the enhanced packages greatly reduce the thermal resistance. For the PTFE device, a more than 23 percent reduction in thermal resistance was observed in WCDMA conditions; the reduction in CW is as much as 28 percent.

RF Power Transistor Packages Components for Wireless Kyocera

Kyocera provides packages for RF power transistors, including silicon LDMOS-FET devices, GaAs FET/HEMT devices and wide-band-gap semiconductor FET/HEMT devices using GaN, SiC and other materials. Our low-electrical-resistance ceramic feedthroughs and low-thermal-resistance heat-sink materials are available for high-power devices.

Solder Reflow Attach Method for High Power RF Devices in Air Cavity

As mentioned earlier, RF power devices are manufactured in both AC and Over--Molded Plastic (OMP) packages. Figure 3 shows the schematic representing a typical cross--section of an AC package. LEADS DIE WINDOW FLANGE FRAME LID Figure 3. Air Cavity Package Construction for Power Devices In an AC package, the Si die is typically attached to a Au

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSIO(id:). View product details of MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSIO from Zhuzhou Jiabang Refractory Metal , Ltd manufacturer in EC21

Copper Tungsten, Molybdenum Copper, Cu/Mo/Cu Heat Sinks and Shims

Torrey Hills’ heat sinks manufacturing facility specializes in the RD and production of high-tech electronic packaging materials, namely Copper tungsten (WCu, CuW), Molybdenum copper (MoCu, CuMo), and copper molybdenum copper (Cu/Mo/Cu) heat sinks and shims.

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